CRUSHERS AND SCREENS For Aggregates Industry
GRINDING APPARATUS AND GRINDING METHOD
Grinding Method. Next, a grinding method using the double-head grinding machine 1 will be described. The grinding method will be exemplarily described in an instance where the inclination angle θ of the spindle 31 is zero when the to-be-measured surface 35A is in parallel to the XY plane SA, in other words, when the spindle 31 is perpendicular
Grinding method and apparatus OHNO; IETATSU
A grinding method is provided which is capable of uniformly and precisely grinding objects for a short time, softening shocks produced when the rotation of a grinding barrel is changed between the forward direction and the backward direction to thereby eliminate bruises on the surface of grounded objects, coping with grinding for a large number of objects to be ground in a small quantity or a
US10286520B2 Grinding apparatus and grinding method
Both side grinding method and both side grinder of thin disc-like work CN1631616A (en) 2004-12-30: 2005-06-29: 暨南大学: Optical fiber side edge polishing and grinding apparatus and its processing method JP2009095976A (en) 2007-10-17: 2009-05-07: Siltronic Ag
Grinding method of a workpiece and grinding apparatus
A surface grinding apparatus 1 shown in FIG. 4 and FIG. 5, has a workpiece 2, a grinding wheel 3, a work table 4 which can reciprocate in the horizontal direction (X-axis direction), a working bench part 5, an electromagnetic chuck 6, a saddle 7 which can reciprocate in the forward/reverse direction (Z-axis direction), an operation panel 8, a grinding wheel cutting start point position
Grinding method and grinding apparatus System Seiko
28-11-2000· The grinding method according to the present invention comprises steps of: rotating and driving a grinding tool in contact with a work, by a grinding shaft; supplying a first fluid pressure to a primary fluid pressure cylinder having a first piston rod connected with the grinding shaft, thereby to apply a primary load to the grinding shaft; supplying a second fluid pressure higher than the
GRINDING APPARATUS AND GRINDING METHOD Patent
A grinding apparatus (100) is provided with a rotating grinding tool (102) for grinding a subject (101) which is to be processed and is immersed in a cooling liquid (106) vibration generating mechanisms (107a-107f) for generating cavitation by applying vibration to the cooling liquid (106) and a controller (108) for making the vibration generating mechanisms (107a-107f) generate cavitation
GRINDING APPARATUS AND GRINDING METHOD Patent
GRINDING APPARATUS AND GRINDING METHOD (PAT US2011065066) SEGAWA TERUTSUGU, HAMANO SEIJI, SUGATA FUMIO PANASONIC CORP. Patent: Patent Appl. Publ. within the TVPP United States. Application: US20090993413 on 2009
US20060040584A1 Method and apparatus for grinding
Apparatus for high speed grinding includes a diamond-bonded abrasive wheel, a drive mechanism for mounting and rotating the grinding wheel at peripheral speeds up to approximately 200 m/s, and a liquid coolant supply system including a delivery system for directing liquid coolant to the point of grinding
Method and apparatus for optimizing grinding General
Method and apparatus for optimizing grinding . United States Patent 4604834 . Abstract: A cylindrical grinding process is controlled by measuring the precession of lobes about the grinding wheel and the workpiece and employing the measured lobe precessions to determine an exponential chatter growth index, which is a measure of the
GRINDING APPARATUS AND GRINDING METHOD Patent
GRINDING APPARATUS AND GRINDING METHOD (PAT EP2298499) SEGAWA TERUTSUGU, HAMANO SEIJI,SUGATA FUMIO. PANASONIC CORP. Patent: Publ. of Application with search report European Patent Office. Application: EP20090769830 on 2009-04-06. Publication: 2011-03
GRINDING APPARATUS AND GRINDING METHOD
GRINDING APPARATUS AND GRINDING METHOD (PAT EP2298499) SEGAWA TERUTSUGU, HAMANO SEIJI,SUGATA FUMIO. PANASONIC CORP. Patent: Publ. of Application with search report European Patent Office. Application: EP20090769830 on 2009-04-06. Publication: 2011-03
GRINDING APPARATUS AND GRINDING METHOD
A grinding apparatus (100) is provided with a rotating grinding tool (102) for grinding a subject (101) which is to be processed and is immersed in a cooling liquid (106) vibration generating mechanisms (107a-107f) for generating cavitation by applying vibration to the cooling liquid (106) and a controller (108) for making the vibration generating mechanisms (107a-107f) generate cavitation
Wafer grinding method and wafer grinding apparatus
A wafer grinding method and a wafer grinding apparatus for grinding a wafer by performing both of the rough grinding process and the fine grinding process are disclosed. After the coarse grinding process, prior to the fine grinding process, the wafer is measured with a non-contact thickness measuring means, and during the fine grinding process the final thickness is finely regulated by using
GRINDING APPARATUS AND GRINDING METHOD
GRINDING APPARATUS AND GRINDING METHOD (PAT US2011065066) SEGAWA TERUTSUGU, HAMANO SEIJI, SUGATA FUMIO PANASONIC CORP. Patent: Patent Appl. Publ. within the TVPP United States. Application: US20090993413 on 2009
Apparatus and Method for Grinding Workpiece
An apparatus and method for grinding a workpiece by rotating the workpiece about a rotational axis, rotating a cylindrical grinding wheel about a rotational axis being parallel to the rotational axis of the workpiece, moving the grinding wheel relative to the workpiece at least in one of a first direction being perpendicular to the rotational axis of the workpiece for grinding the workpiece at
Sparrho Adjustable grinding method and apparatus
3. The method of claim 2 including providing a motor drive for said rotary grinder to rotate same, and supporting said motor drive on said slide. 4. The method of claim 1 wherein said grinder includes a grinding head, and said operating of said grinder includes moving said head along an angle defined by said rotating tapered bore. 5.
Grinding assembly, grinding apparatus, weld joint defect
@article{osti_1175505, title = {Grinding assembly, grinding apparatus, weld joint defect repair system, and methods}, author = {Larsen, Eric D. and Watkins, Arthur D. and Bitsoi, Rodney J. and Pace, David P.}, abstractNote = {A grinding assembly for grinding a weld joint of a workpiece includes a grinder apparatus, a grinder apparatus includes a grinding wheel configured to grind the weld
KR0167021B1 Automatic grinding apparatus Google
Grinding method with grinding force control JPH04101760A (en) * 1990-08-20: 1992-04-03: Meidensha Corp: Control method for working robot EP0492014B1 (en) * 1990-12-28: 1996-03-20: Aiko Engineering Co. Ltd. Automatic grinding apparatus
「grinding apparatus」に関連した英語例文の一覧と使い
grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same 例文帳に追加 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置 特許庁
「grinding apparatus」に関連した英語例文の一覧と使い
grinding apparatus の部分一致の例文一覧と使い方. 該当件数 : 584件
Apparatus and Method for Grinding Workpiece
An apparatus and method for grinding a workpiece by rotating the workpiece about a rotational axis, rotating a cylindrical grinding wheel about a rotational axis being parallel to the rotational axis of the workpiece, moving the grinding wheel relative to the workpiece at least in one of a first direction being perpendicular to the rotational axis of the workpiece for grinding the workpiece at
GRINDING APPARATUS AND GRINDING METHOD
A grinding apparatus (100) is provided with a rotating grinding tool (102) for grinding a subject (101) which is to be processed and is immersed in a cooling liquid (106) vibration generating mechanisms (107a-107f) for generating cavitation by applying vibration to the cooling liquid (106) and a controller (108) for making the vibration generating mechanisms (107a-107f) generate cavitation
Wafer grinding method and wafer grinding apparatus
A wafer grinding method and a wafer grinding apparatus for grinding a wafer by performing both of the rough grinding process and the fine grinding process are disclosed. After the coarse grinding process, prior to the fine grinding process, the wafer is measured with a non-contact thickness measuring means, and during the fine grinding process the final thickness is finely regulated by using
Method And Apparatus For Grinding Rubber henrys
Method And Apparatus For Grinding Rubber. Abstract a rubber grinding machine and method is provided for ambient temperature grinding of rubber material to form finely ground rubber particleshe rubber grinding machine includes a feed tube, a grinding module, a conveyor, a screening module and a vacuum systemubber material is placed in the feed tube which advances the rubber material into the
Apparatus And Methods For Wet Grinding
wet grinding, the tool life is significantly prolonged, since less material is removed. The dry grinding method leaves a hard compacted burr, which is very difficult to remove. The evidence suggests that using a wet-grinding method gives a sharper edge and cleaner cuts with more than double the effective turning time between sharpening.
Improved silicon grinding method and apparatus.
Get this from a library! Improved silicon grinding method and apparatus.. [Jet Propulsion Laboratory (U.S.); United States. National Aeronautics and Space Administration.;]
NEW Patent CD for Grinding method and grinding
Amazon : NEW Patent CD for Grinding method and grinding apparatus : Other Products : Everything Else
Continuous vacuum grinding method and apparatus
An improved method and apparatus for the continuous vacuum grinding of meat or other products is provided which permits continuous deaeration and grinding so as to materially enhance the organoleptic properties of final meat products such as sausages and the like.
Basics of Grinding Manufacturing
4. The cylindrical grinding methods finish: a. internal diameter surfaces b. horizontal surfaces c. external surfaces d. protruding surfaces 5. Internal grinding requires the grinding wheel to move: a. vertically up and down b. transversely c. longitudinally d. transversely and reciprocally 6. Workpiece movement in centerless grinding is
「grinding apparatus」に関連した英語例文の一覧と使い
grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same 例文帳に追加 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置 特許庁
Wafer grinding method and wafer grinding apparatus
A wafer grinding method and a wafer grinding apparatus for grinding a wafer by performing both of the rough grinding process and the fine grinding process are disclosed. After the coarse grinding process, prior to the fine grinding process, the wafer is measured with a non-contact thickness measuring means, and during the fine grinding process the final thickness is finely regulated by using
GRINDING METHOD AND APPARATUS WESTERN
In a method of and apparatus for grinding a cylindrical workpiece, the speed of the grinding wheel (14) and/or of the workpiece (18) is changed during the final dwell period in which sizing occurs, and the following additional steps are carried out: the rotational speed of the wheel and/or of the workpiece is measured, the target ratio of wheel speed to workpiece speed is calculated, and the
Apparatus and Method for Grinding Rotary Blades
The grinding tool and the rotary blade attached in the mount are movable relative to one another such that a blade edge extending at the periphery of the rotary blade can be ground by the grinding tool. The apparatus includes a measuring device for determining the extent of the blade edge and a control which is designed to use the determined
Basics of Grinding Manufacturing
4. The cylindrical grinding methods finish: a. internal diameter surfaces b. horizontal surfaces c. external surfaces d. protruding surfaces 5. Internal grinding requires the grinding wheel to move: a. vertically up and down b. transversely c. longitudinally d. transversely and reciprocally 6. Workpiece movement in centerless grinding is
Continuous vacuum grinding method and apparatus
An improved method and apparatus for the continuous vacuum grinding of meat or other products is provided which permits continuous deaeration and grinding so as to materially enhance the organoleptic properties of final meat products such as sausages and the like.
Method and apparatus for nozzle type ELID grinding
Method and apparatus for nozzle type ELID grinding US7758741; There is here disclosed a nozzle type elid grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH −) onto a surface of the conductive grindstone, the workpiece being ground while the
Improved silicon grinding method and apparatus.
Get this from a library! Improved silicon grinding method and apparatus.. [Jet Propulsion Laboratory (U.S.); United States. National Aeronautics and Space Administration.;]
Apparatus and method for grinding eyeglass lenses
Apparatus and method for grinding eyeglass lenses. 0839609 EP97118829A1 EPO Application Oct 29, 1997 Publication May 06, 1998 Ryoji Shibata Hirokatsu Obayashi. Abstract.
「grinding apparatus」に関連した英語例文の一覧と使い
grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same 例文帳に追加 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置 特許庁
「grinding apparatus」に関連した英語例文の一覧と使い
The apparatus for grinding endothelium of nut is equipped with a grinding container 36 having a plurality of grinding rotors 48. 例文帳に追加. 堅果の内皮研削装置は、複数の研削転子48を有する研削容器36を備える。 特許庁